Surface Processing
From grinding to final polishing.
Wafer and substrate preparation is a multi-stage process. Each stage requires a different balance of removal rate, surface damage, flatness, particle size, and final surface quality.
GrindingCoarse LappingIntermediate LappingFine LappingFinal PolishingCleaning
Diamond Abrasive Slurries
Diamond suspensions for coarse, intermediate, fine, and precision finishing applications.
Lapping Slurries
Abrasive formulations designed for controlled material removal and surface preparation.
Polishing Slurries
Fine and final polishing formulations developed around surface quality, defect control, and process requirements.
Applications
Process experience across hard and precision materials.
- Sapphire substrates
- Silicon wafers
- SiC substrates
- Compound semiconductor substrates
- Precision ceramics
- Other advanced materials requiring controlled surface finishing
Cleaning Chemistry
Cleaning is part of the surface-finishing process.
FabSemiChem supports cleaning solutions for removal of residual particles, slurry components, and process contaminants between or after polishing steps.