CMP slurries designed around the process.
CMP slurry is a stabilized abrasive suspension combined with process-specific chemical additives. FabSemiChem supports formulation based on target polishing performance, surface requirements, and process conditions.
Abrasive System
Electronic-grade abrasive systems such as silica, alumina, diamond, and other application-specific materials.
Chemical Additives
Process-specific additives may include oxidizing chemistry, complexing agents, corrosion inhibitors, surfactants, dispersants, pH control, and stabilizers.
Suspension & Stability
Particle behavior, suspension stability, filtration, storage stability, and cleaning compatibility all contribute to performance.
The process does not end at polishing.
Residual particles, slurry components, metallic contamination, and organic residues can affect downstream processing. FabSemiChem supports post-CMP cleaning chemistries designed around particle removal, surface compatibility, ionic cleanliness, residue removal, and downstream process requirements.