Wafer · Substrate · Semiconductor Processing

Specialty electronic chemicals built around the process.

FabSemiChem provides process-focused electronic chemicals for wafer and substrate grinding, lapping, polishing, CMP, photolithography, and cleaning, with U.S.-based cleanroom manufacturing in San Diego, California.

CMP SlurriesDiamond SlurriesPolishing ChemistriesPost-CMP CleanersDevelopersEBRCustom Formulations
Process-Focused, Not Product-Only

Surface quality is determined by the entire process — not by slurry alone.

Successful surface finishing depends on abrasive selection, particle size, suspension stability, polishing pads, lapping plates, cleaning chemistry, water quality, handling, and contamination control. FabSemiChem looks at the complete process — from material removal through final polishing and cleaning.

Core Capabilities

From surface preparation to final cleaning.

Wafer & Substrate Finishing

Grinding, lapping, polishing, diamond slurry, and cleaning chemistry across multi-stage surface preparation.

Learn more →

CMP & Post-CMP

Stabilized abrasive suspensions and process-specific chemical additives designed around target polishing performance.

Learn more →

Photolithography Chemistry

Developers, EBR, thinners, cleaning solvents, and custom concentrations for process-specific applications.

Learn more →
Manufacturing

U.S.-based cleanroom manufacturing in San Diego.

Our manufacturing approach is centered on contamination control, process consistency, and controlled small-batch production using high-purity raw materials, deionized water, cleanroom-based mixing, filtration, and filling.

  • Particle control
  • Ionic cleanliness
  • High-purity raw materials
  • Controlled filtration
  • Clean packaging practices
  • Batch-to-batch consistency